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Abstract
An investigation studied the effects of material and application factors on the peel creep-rupture response and peel strength of EPDM tape-bonded seam specimens. Two material factors (tape system and thickness) and 5 applications were examined in a two level statistically designed experiment. Some tapes had thicknesses typical of those comercially available at the time of the study, and were designated as having "standard" thickness. The thickneses of "standard" and thin tapes were approximately 0.9mm and 0.6mm respectively. Specimens were prepared either primed or unprimed using EPDM that was either cleaned or contaminated. Applcation temperatures were low, 5C or high 60C, and applicatoin pressures were low, 0.2 MPa or high, 2MPa. The time at which the specimens remained at the application temperature where short, about 24 hours, or long 672-960 hours. To interpret the data, plots of mean time-to-failure and mean peel strenght versus the combinations of application factors for each of the four pairs of tape system and tape thicknesses were analyzed. Comparisons of times-to-failure between the tape-bonded samples were made with those of liquid-adhesive-bonded sample sets tested in an earlier phase of the study. The main conclusions regarding tape bonded seams form the present investigation are that: 1) primed, clean EPDM provided the longest time-to-failure ahd highet peel strengths. 2) Primed, clenaed EPDM and "standard" thickness tape afforded time-to-failure that were statistically significantly higher than minimum mean time-to-failure of well prepared liquid-adhesive-bonded sample sets determined in an earlier investigation. 3) the applicatoin temperature and application pressures used in the investigation did not affect the time-to-failure of sample sets prepared with primed, clean EPDM, that had, as stated, relatively long time-to-failure. 4) "Standard" thickness tape provided significantly longer time-to-failure than thinner tape. 5) the two tape systems generally repsonded similarly to factors tha promoted either shorter or longer times-to-failure.
An investigation studied the effects of material and application factors on the peel creep-rupture response and peel strength of EPDM tape-bonded seam specimens. Two material factors (tape system and thickness) and 5 applications were examined in a two level statistically designed experiment. Some tapes had thicknesses typical of those comercially available at the time of the study, and were designated as having "standard" thickness. The thickneses of "standard" and thin tapes were approximately 0.9mm and 0.6mm respectively. Specimens were prepared either primed or unprimed using EPDM that was either cleaned or contaminated. Applcation temperatures were low, 5C or high 60C, and applicatoin pressures were low, 0.2 MPa or high, 2MPa. The time at which the specimens remained at the application temperature where short, about 24 hours, or long 672-960 hours. To interpret the data, plots of mean time-to-failure and mean peel strenght versus the combinations of application factors for each of the four pairs of tape system and tape thicknesses were analyzed. Comparisons of times-to-failure between the tape-bonded samples were made with those of liquid-adhesive-bonded sample sets tested in an earlier phase of the study. The main conclusions regarding tape bonded seams form the present investigation are that: 1) primed, clean EPDM provided the longest time-to-failure ahd highet peel strengths. 2) Primed, clenaed EPDM and "standard" thickness tape afforded time-to-failure that were statistically significantly higher than minimum mean time-to-failure of well prepared liquid-adhesive-bonded sample sets determined in an earlier investigation. 3) the applicatoin temperature and application pressures used in the investigation did not affect the time-to-failure of sample sets prepared with primed, clean EPDM, that had, as stated, relatively long time-to-failure. 4) "Standard" thickness tape provided significantly longer time-to-failure than thinner tape. 5) the two tape systems generally repsonded similarly to factors tha promoted either shorter or longer times-to-failure.
Date
5/1997
5/1997
Author(s)
W Rossiter; M Vangel; K Kraft; J Filliben
W Rossiter; M Vangel; K Kraft; J Filliben
Page(s)
53
53
Keyword(s)
adhesive tape; adhesive testing; application factor; creep rupture; EPDM; peel strength; time to failure; seam
adhesive tape; adhesive testing; application factor; creep rupture; EPDM; peel strength; time to failure; seam